Rigiflex Technology specializes in the manufacturing of rigid-flex printed circuit boards (PCBs), flexible printed circuit boards, and rigid printed circuit boards. Their manufacturing capabilities include producing single-sided, double-sided, multi-layer, and rigid-flex circuit boards with specifications such as copper thickness ranging from 0.5 oz to 6.0 oz, board thickness from 0.5mm to 3.0mm, and a minimum drill hole diameter of 0.008 inches. They serve various industries including medical, military, commercial, aerospace, networking and communications, telecom, computing and storage, industrial and instrumentation products, automotive, cellular phones, and consumer and home appliances. The company emphasizes quick turnaround times, offering delivery in 1 to 5 days depending on the complexity of the PCB.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110