CONNECTEC JAPAN Corporation specializes in semiconductor packaging and implementation solutions. The company focuses on various implementation technologies, providing high-quality services in the semiconductor industry. They have a strong emphasis on innovation and collaboration with partners to enhance manufacturing processes and address market needs, particularly in the IoT sector.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110
Heat exchangers, Aluminum profiles, Aluminum tubes, Aluminum plates, Non-corrosive aluminum, High-strength alloy, UV coating aluminum tub...