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About
Tongfu Microelectronics specializes in integrated circuit packaging and testing services. The company provides a one-stop service for design simulation and packaging testing, covering various fields including network communication, mobile terminals, home appliances, artificial intelligence, and automotive electronics. It utilizes advanced technologies such as Flip Chip and Fan Out packaging, with capabilities for high pin count and high performance ASICs, and offers extensive test development for a range of products including CPUs, GPUs, and microcontrollers.
Products & Services
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Quick Facts
- Location
- Nantong, China, China
- Category
- Electronics Manufacturing
