Shincron Co., Ltd. specializes in the research, development, design, manufacturing, sales, and technical services of vacuum thin film formation equipment and various key components. The company serves industries such as optics, electronic devices, medical, telecommunications, automotive, electronics, IT, and academia, providing advanced thin film technologies for applications in optical coatings, electronic components, and more.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems