330 Electronics LLC specializes in PCB assembly and electronics manufacturing, providing services such as Surface Mount Technology (SMT) assembly, Through-Hole (THT) PCB assembly, and custom electronic temperature control systems. They offer full-scale production, low-volume production, and prototype builds, with a focus on precision-engineered circuit boards tailored to client specifications. Their capabilities include automated selective soldering, post-assembly reflow, visual inspection, and functional testing. The company serves OEMs, industrial engineers, and product designers, emphasizing responsive engineering support and hands-on collaboration.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems