Kessler Engineering GmbH specializes in custom electronics development throughout the entire product lifecycle. They provide services from circuit design and hardware development to app and software solutions, including prototype manufacturing, industrialization, and series production. The company also handles packaging, logistics, and refurbishment. They focus on developing hardware tailored to specific products, selecting optimal components, creating schematics and layouts, and ensuring electromagnetic compatibility (EMC) design. Additionally, they develop embedded software that fits their hardware, covering everything from low-level drivers to complex applications.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110