TEWS Technologies GmbH specializes in the design and manufacturing of embedded I/O solutions, including a wide range of mezzanine modules and carrier boards. Their products are utilized in various applications such as industrial control, telecommunications, medical equipment, and traffic control. The company offers custom solutions and design services, including FPGA development and software support, ensuring compatibility with specific operating systems. Their manufacturing capabilities include state-of-the-art production facilities with temperature and humidity control, and they provide products that operate in extended industrial temperature ranges.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110