Micon Global supplies a range of semiconductor and electronics development and manufacturing services, including ASIC development, design and layout services, wafer foundry services, packaging design, test services, and electronic product design. They also provide services related to PCB design, assembly, and testing, as well as software solutions including embedded software and enterprise software. Their offerings cater to the semiconductor and electronics industries, addressing needs for high-performance and reliable components.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110
“American company”
“Digital radio IP core provider”
“Mobile app and web development company”
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