Fidus Systems specializes in the design and development of custom embedded systems, including FPGA design, hardware and PCB layout, embedded software, and signal and power integrity services. They utilize advanced technologies such as heterogeneous computing across CPUs, FPGAs, GPUs, and NPUs to optimize performance, power efficiency, and throughput. Their capabilities include ASIC design, UVM verification, and validation processes, serving industries that require high-speed data processing and complex hardware-software integration.
“Wealth management provider”
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FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110