CoolSem Technologies specializes in wafer-level thermal management technology that enhances the performance and longevity of semiconductor devices. Their patented WaLTIS® technology significantly reduces thermal resistance by up to 15 times, effectively eliminating hotspots that can degrade device performance and reliability. This technology is compatible with various materials including GaN, GaAs, InP, and SiC, and integrates seamlessly into existing manufacturing processes without altering upstream designs or downstream assembly flows.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems