Mobilint, Inc. manufactures high-performance AI chips, specifically NPU solutions optimized for edge AI tasks. Their products include the ARIES AI accelerator chip, which delivers 80 TOPS performance at low power consumption, and the REGULUS AI System-on-Chip (SoC), which provides 10 TOPS computing power for on-device applications. These products are designed for various applications, including robotics, smart factories, smart cities, and security systems, and support over 400 deep learning models across multiple machine learning frameworks.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110