Shengyi Technology Co., Ltd. specializes in the development and production of PCB laminates, including FR4, CEM1, CEM3, and prepreg materials. The company employs advanced manufacturing capabilities and maintains a state-of-the-art facility in Dongguan, China. Their products are utilized in single-sided, double-sided, and multilayer printed circuit boards, serving various industries such as mobile phones, automotive, telecommunication equipment, and higher-level electrical products.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110