Cedatec Srl specializes in the production of printed circuit boards (PCBs) and printed wiring boards (PWBs). The company has a strong manufacturing capability in the machine-tools field, leveraging over 39 years of experience. They also produce the VLP Press machine, which is patented and designed for green technology applications, focusing on quality improvement and energy savings. Their products serve various industries including Aerospace, Automotive, Telecommunication, Defense, and Pharmaceutical.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems