Glendale Electronic Components Pte. Ltd. specializes in providing engineering solutions, including mechanical design and engineering services, electronic computer-aided design (ECAD), software and engineering development, supply chain management, and PCB assembly. They utilize advanced 3D modeling, rapid prototyping, and precise schematic layouts to deliver customized solutions. Their capabilities include PCB design, layout routing, multi-layer design, and high power circuit design, serving various electronic industries with a focus on quality and reliability.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110