Multek Corporation specializes in the manufacturing of advanced interconnect solutions, particularly focusing on multilayer rigid printed circuit boards (PCBs) and high-density interconnect (HDI) technologies. Their capabilities include complex multilayer PCB processing, high-speed and ultra low-loss materials, thermal solutions with embedded copper coins, and various microvia technologies. They serve industries such as telecommunications, computing, automotive, medical, and consumer electronics, providing products that range from early prototypes for new product introduction to high-volume mass production.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110