budatec GmbH manufactures systems for the semiconductor and solar industries, focusing on thermal systems and products for electronics manufacturing. Their product range includes vacuum soldering systems and sintering systems for semiconductor chips, with capabilities for small batch production to fully automated systems. Their equipment is utilized globally in the production of electronic and power electronic components, automotive suppliers, laser manufacturing, and medical technology. They also support research institutions with their systems for developing new technologies.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110