Pactron specializes in semiconductor services, providing design, development, and manufacturing capabilities for a variety of semiconductor testing and production needs. Their offerings include ATE board development, probe cards for wafer-level testing, reliability and burn-in engineering services, and IC characterization boards. They utilize advanced technologies and processes such as signal integrity and power integrity simulations, PCB assembly, and embedded software development. Pactron serves industries requiring high-quality semiconductor solutions, ensuring compliance with rigorous testing standards.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110