TLG Technology specializes in the manufacturing of nano-fabrication equipment and semiconductor process equipment, including metrology and alternative source solutions for the semiconductor wafer and electronics industries. Their capabilities include advanced optical profilometry, focused ion beam (FIB) processing, and electron beam lithography (EBL), which are utilized for high-precision applications in nanoelectronics, photonics, and biomedical devices. They provide a range of products such as wet process systems, wafer processing equipment, and metrology instruments, serving major wafer fabs and technology research institutes in the South-East Asia region.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110