Multibeam Corporation specializes in high-productivity electron beam lithography (EBL) systems, specifically the Multicolumn E-Beam Lithography platform. This technology is used for rapid prototyping and production of advanced semiconductor devices, including applications in advanced packaging, compound semiconductors, MEMS and sensors, photonics, and secure chip identification. The systems are capable of high precision patterning with resolutions below 50nm on 200mm wafers, and they support complex topographies and high-density interconnects. Multibeam's technology enables features such as adaptable patterning, high depth of focus, and the ability to handle non-planar surfaces, making it suitable for next-generation integrated circuits and quantum devices.
“American semiconductor designing company”
“American software company”
“Building maintenance service provider”
“Financial services company based in Fremont, California”
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FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110