ICsense specializes in the design and supply of custom Application-Specific Integrated Circuits (ASICs) for various industries, including automotive, medical, industrial, and consumer markets. They offer full turnkey ASIC solutions from concept to mass production, utilizing advanced design and verification environments to ensure low-risk and high-quality developments. Their manufacturing capabilities include in-house Automated Test Equipment (ATE) for testing, wafer probing, and final test capabilities, with a focus on high-voltage, mixed-signal, and analog designs. ICsense has completed over 170 tape-outs across technology nodes from 28nm to 0.5µm, and their production capacity exceeds 500 million ASIC units annually.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110