Keiron specializes in advanced solder paste printing technology, specifically through its LiFT (Laser-Induced Forward Transfer) system. This fully digital, contactless process allows for precise solder paste application with ultra-small deposits (01005) and real-time volume verification using integrated Solder Paste Volume Metrology (SPVM). The technology eliminates the need for traditional consumables such as stencils, nozzles, and ejectors, enhancing efficiency and reducing operational costs. Keiron's systems are designed for surface mount technology (SMT) manufacturing, ensuring high precision, repeatability, and improved production throughput.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems