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Qp Technologies
Electronics Manufacturing
About
QP Technologies specializes in microelectronic packaging and assembly, wafer preparation, and substrate design and development services. They provide a full range of semiconductor services including wafer thinning, IC assembly, advanced packaging, and substrate development. Their capabilities support prototype through production programs across aerospace, defense, medical, and commercial microelectronics applications. They utilize advanced technologies for wafer backgrinding and dicing, with precision processing for wafers up to 300mm in diameter, and offer services such as die sorting, inspection, and cleaning.
Products & Services
wafer preparationIC assemblyadvanced packagingsubstrate developmentwafer backgrindingwafer dicingdie sortinginspectionwafer cleaning
Certifications
MIL-STD-883
Quick Facts
- Location
- Escondido, United States, United States
- Founded
- 1992
- Category
- Electronics Manufacturing
