Beijing CGB Technology Co., Ltd. specializes in the research, development, production, sales, and service of professional equipment in the semiconductor, semi-semiconductor, and new materials fields. The company manufactures wet processing equipment, fully automatic wafer beveling machines, fully automatic cleaning machines, dryers, and chemical supply systems. Their products are used in various applications including integrated circuits (IC), micro-electromechanical systems (MEMS), silicon materials (Si), compound semiconductors, optical communication devices, power devices, semiconductor lighting (LED), photovoltaic cells, flat panel displays (FPD), and research and development (R&D).
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110