KOKI Company Limited manufactures a range of soldering materials, including low void multi-feature solder paste, cost-effective high-reliability low silver lead-free solder paste, and zero flux residue solder paste designed for oxidation-reduction vacuum reflow processes. Their products cater to the electronic devices industry, specifically for consumer and industrial applications, focusing on high durability, heat dissipation, and environmental sustainability. They utilize advanced alloy and flux technologies to enhance soldering performance and reliability.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110