Redtec Industries Pte Ltd manufactures EMI shielding, absorbing materials, and thermal interface materials. Their products are designed to minimize electromagnetic interference and enhance thermal management in electronic devices. They utilize specialized processes to create materials such as carbon-filled urethane foam absorbers and silicone-based thermal interface materials, which are effective in reducing thermal resistance. The company serves various industries, including consumer electronics, telecommunications, and IoT applications.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110