Octavo Systems specializes in System-in-Package (SiP) technology, integrating processors, memory, power management, and other essential components into compact packages. Their products include the OSD32MP15x, OSD32MP2x, OSD335x, and OSD62x families, which are designed for applications in industrial automation, IoT gateways, and artificial intelligence. These SiPs simplify hardware design by reducing the number of components needed, thus lowering manufacturing costs and accelerating product development timelines.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110