MEDS Technologies PTE LTD specializes in the manufacturing and supply of RF components, cables, connectors, and wire-harness products. They provide foundry services that include design enablement with access to EDA/CAD tools and foundry PDK, as well as multi-project wafer prototype runs and low to high volume production. Their backend services encompass wafer back grinding, die pick and place, assembly, air cavity packaging, failure analysis, and PCB/PCBA. The company serves various industries including telecommunications, avionics, and commercial/industrial applications.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems