Xpeedic Co, Ltd provides advanced electronic design automation (EDA) solutions for semiconductor chip design, focusing on high-speed digital design, IC package design, and RF analog mixed signal design. Their technologies address challenges in high-performance computing, RF systems, memory, and power devices, utilizing multi-physics co-simulation capabilities to optimize designs across chip, package, module, and system levels. They serve industries such as telecommunications, automotive, and data centers, with a particular emphasis on applications requiring high bandwidth, low power consumption, and efficient thermal management.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110