Deepx manufactures edge AI semiconductors, specifically focusing on AI chips and modules designed for low power consumption and high performance. Their products, such as the DX-M1 and DX-M2, deliver significant processing capabilities with low thermal output, making them suitable for applications in edge computing, smart mobility, smart factories, smart cities, and video management systems. The DX-M1 chip, for instance, operates at 1-5W while providing 25 TOPS (INT8) performance, and is designed to support various AI frameworks like TensorFlow and PyTorch.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110