SCHUNK Electronic Solutions GmbH specializes in the manufacturing of separation machines for electronic assemblies, specifically designed for the efficient separation of individual printed circuit boards (PCBs) from larger panels. Their product line includes manual and fully automatic inline separation machines, such as the SAR Compact, SAR 800, ILR 1800, and SAR 1300 BD2, which utilize milling, sawing, and laser cutting techniques to achieve high precision and productivity. The machines are capable of handling various board sizes, with a milling area of up to 500 mm x 600 mm, and are designed to meet the increasing demands for miniaturization and high-quality standards in the electronics manufacturing industry.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110