Shinko Electric Industries Co Ltd manufactures semiconductor packages, heat dissipation components, and products for semiconductor manufacturing equipment. They utilize advanced processing technologies such as precision stamping and etching to produce various lead frames and interconnect technologies for IC assembly. Their offerings include ceramic products tailored to meet cutting-edge customer needs, as well as metal processing products that leverage their semiconductor packaging technologies. The company serves industries including computer and network equipment, mobile devices, industrial IoT, and automotive applications.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110