Lansdale Semiconductor, Inc. specializes in aftermarket technology manufacturing and supplies for discontinued semiconductors and integrated circuits. They manufacture over 3,000 classic design integrated circuits (ICs) in the original package, including RF and wireless ICs such as phase locked loops (PLLs), prescalers, frequency synthesizers, transmitters, receivers, transceivers, voltage controlled oscillators (VCOs), FM subsystems, analog-to-digital converters, modems, codecs, and drivers/receivers. Lansdale is dedicated to providing a continuous supply of these critical components to support mature designs and spares requirements.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
NVMe SSD, SATA SSD, U.2, E1.S, 2.5inch SSD, M.2 2280, M.2 2242, CFast, mSATA, PATA, CompactFlash, SD Card, microSD Card, eSD, USB Drive, ...
5G/6G technology, satellite communication systems, customizable SoC ASIC designs, image processing systems