Toppan Technical Design Center INC. specializes in LSI (Large Scale Integration) production services, offering turnkey solutions and prototyping services that utilize leading-edge technologies. Their capabilities include low power consumption designs, high precision measurements, and customizable internal arithmetic for sensor properties. They provide services for various applications including RF, mixed signal, CMOS image sensors, and high-voltage technologies, supporting clients from design verification to volume production.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110