HLB Innovation specializes in the semiconductor and biotechnology industries, focusing on the production of lead frames and advanced industrial components. The company manufactures a variety of lead frames, including high pin and heat slug attached lead frames, as well as memory semiconductor LOCs. HLB Innovation is committed to developing precision technologies such as super fine pitch, deep downset, and hi-density lead frames to meet the demands of high integration, multifunctionality, and high performance in semiconductor applications.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110