HAESUNG DS Co., Ltd. specializes in semiconductor components, particularly lead frames, PCB substrates, tape substrates, and graphene materials. The company employs various manufacturing processes including etching, stamping, and reel-to-reel production to create customized products for the semiconductor industry. Their offerings include high-precision lead frames for chip support and electrical connections, PCB substrates for memory semiconductors, and tape substrates for smart cards. HAESUNG DS is recognized for its advanced production capabilities and commitment to quality.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110