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About
STATS ChipPAC Pte. Ltd. specializes in integrated circuit manufacturing and technology services, offering a full range of turnkey services including semiconductor package integration design, R&D, wafer probing, wafer bumping, package assembly, final testing, and drop shipment. The company serves critical industries such as automotive, computing, memory, AI, and energy systems, providing application-specific packaging solutions that meet performance, reliability, and integration needs.
Products & Services
semiconductor package integration designwafer probingwafer bumpingpackage assemblyfinal testingautomotive MCUsQFPQFNcopper wire BGAflip-chipSiPfan-out WLPXDFOI® high-density fan-out chiplet platformNAND Flash packagingDRAM packaging
Quick Facts
- Location
- Singapore, Singapore, Singapore
- Category
- Electronics Manufacturing
