STATS ChipPAC Pte. Ltd. specializes in integrated circuit manufacturing and technology services, offering a full range of turnkey services including semiconductor package integration design, R&D, wafer probing, wafer bumping, package assembly, final testing, and drop shipment. The company serves critical industries such as automotive, computing, memory, AI, and energy systems, providing application-specific packaging solutions that meet performance, reliability, and integration needs.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110
“Autonomous university in Singapore”
“Semiconductor foundry company headquartered in Taiwan”
“Multinational electronics and semiconductors manufacturer”
“Packaging and test service provider”
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