JCET Group specializes in integrated circuit manufacturing and technology services, offering a comprehensive range of semiconductor packaging and test services. The company provides full turnkey solutions that include integrated packaging, testing, and direct shipment to end customers. JCET's capabilities encompass lead-frame packaging, substrate-based packaging, flip-chip interconnects, and advanced wafer-level packaging, addressing the needs of various markets including mobile, networking, computing, consumer, and automotive sectors.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110