Kulicke & Soffa Industries, Inc. specializes in semiconductor assembly technology, providing solutions for power module manufacturing and memory assembly. The company offers a range of products including ultrasonic terminal welding systems, wire bonding solutions, and advanced packaging technologies. Their capabilities include high-precision bonding of copper terminals, vertical wire bonding for higher density memory architectures, and advanced thermo-compression bonding. Kulicke & Soffa serves various industries including automotive, industrial, memory, and communications.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110