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About
Fraunhofer IZM ASSID specializes in high-end performance packaging from wafer to system, focusing on miniaturizing electronic systems, generating packaging processes, and developing manufacturing processes for future microelectronics. They offer a range of services including 2.5/3D technologies, wafer-bumping, wafer-bonding, high-density assembly, and reliability testing, serving industries such as semiconductor, automotive, medical technology, and industrial electronics.
Products & Services
TSV IntegrationSilicon interposer TSV firstTSV via middleTSV via LastDevice stackGlass interposer and TGV-Integration2.5/3D InterposerBackside Interconnects3D Stack FormationFlexible High Density Multi-Layer SubstratesPolymer-Interposer based on thin-film flex technologyHigh Density RedistributionMulti-layer wiringPolymers for high-density interconnectsCopper/Polymer Evaluation Kit
Quick Facts
- Location
- Berlin, Germany, Germany
- Category
- Electronics Manufacturing
