DNJO Technologies Co., Ltd specializes in the design and manufacturing of semiconductor wafer carriers and related products. They offer PFA (Perfluoroalkoxy) cassettes and handles, PTFE (Polytetrafluoroethylene) custom products, and various models of multifunctional FOUPs (Front Opening Unified Pods) that are compatible with different wafer sizes. Their products are designed to withstand high temperatures and harsh chemical environments, making them suitable for semiconductor fabrication processes.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110