Rogue Valley Microdevices specializes in MEMS foundry services, providing integrated design, process development, and manufacturing for advanced silicon devices. They support the full MEMS development lifecycle, offering custom MEMS device fabrication, sensor and microdevice manufacturing, photonics and specialty semiconductor integration, and transitioning from prototype to volume production. Their capabilities include wafer processing services for silicon substrates, thermal oxidation, LPCVD and PECVD thin films, and metal deposition.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110
“U.S. federal executive department overseeing commerce”
“Software and molecular infrastructure provider”
“Microelectronics research center in Bromont, Quebec, Canada”
“Manufacturing equipment provider”
“Health and fitness provider”
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