Firan Technology Group specializes in manufacturing high-reliability printed circuit boards (PCBs) and avionics sub-system hardware. They offer advanced capabilities in Semi Additive Process (SAP), High Density Interconnect (HDI), High Temperature Rigid Flex, and RF products. Their products are designed for the aerospace, space, and defense sectors, focusing on complex PCBs and avionic assemblies that meet stringent performance and reliability standards.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110