microfab Service GmbH specializes in the production of microsystems components, including prototypes and engineering samples, as well as small and large volume manufacturing through contract manufacturers. They offer specialized MEMS process technologies and a wide range of modular options, focusing on surface micromachining, bulk micromachining, silicon deep etching, and wafer bonding. Their production capabilities include processing silicon and glass wafers of 100mm to 150mm diameter in state-of-the-art cleanroom facilities, serving industries such as automotive, communications, medical, and consumer electronics.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110