Garner Osborne specializes in PCB manufacturing, PCB assembly, and box build services. They have over 30 years of experience and utilize state-of-the-art machinery capable of producing a variety of printed circuit boards, including HDI, ceramic, flexi, and metal-backed boards. Their manufacturing process includes stringent quality assurance measures such as DFM checks, AOI, and 100% flying probe testing. They cater to industries such as aerospace, defense, and IoT, providing both small and large-scale production capabilities.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110