VLSIP Technologies, Inc. specializes in advanced semiconductor packaging and electronic assembly solutions, serving the semiconductor industry. They provide a full array of advanced interconnect technologies, including flip chip, 3D packaging, and System-in-Package (SiP) technologies. Their capabilities include mechanical sawing, automated die sorting, and high-precision assembly solutions for diverse materials such as SiGe, GaAs, and GaN. VLSIP supports complex assembly solutions and offers full turnkey test solutions, ensuring product integrity through rigorous reliability qualification and failure analysis.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110