BOPLA specializes in the development and production of electronic enclosures made from plastic and aluminum, as well as input units such as HMI systems and membrane keypads. They offer a wide range of enclosures that protect electronic components from damage and provide customizable designs for various applications. Their manufacturing capabilities include individual enclosure solutions, mechanical processing, and integration of touch/display technologies, serving industries such as medical technology, mechanical engineering, building management, and agricultural technology.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110