Bosch specializes in semiconductor and sensor solutions, particularly in the automotive sector. They manufacture MEMS (Micro-Electro-Mechanical Systems) sensors, SiC power semiconductors, and automotive integrated circuits (ICs). Their MEMS sensors are used in safety systems, Advanced Driver Assistance Systems (ADAS), comfort systems, and ICE powertrain systems, among others. Bosch has developed proprietary manufacturing processes, including the Deep Reactive Ion Etching (DRIE) process, to produce high-precision MEMS sensors that meet stringent automotive standards.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110
“Technology leader for consumer electronics”
Relationships from industry sources. Names without links aren't yet in our directory.