VEXOS specializes in high-mix, high-complexity, mid to low-volume electronics manufacturing and custom material solutions. They provide services such as printed circuit board assembly (PCBA), sub-system assemblies, and box build, serving critical markets including automotive, medical, lighting, display technology, HVAC, health and fitness equipment, and consumer electronics. VEXOS operates globally with manufacturing facilities in North America and Asia, offering extensive supply chain solutions and a commitment to quality.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110