LZJPCB specializes in the manufacturing of printed circuit boards (PCBs) and PCB assembly (PCBA) services. They offer capabilities for producing PCBs with 1 to 32 layers, including advanced multi-layer PCB fabrication, flexible and rigid-flex circuit solutions, and high-density interconnect (HDI) designs. Their manufacturing processes include surface mount technology (SMT) and through-hole assembly, with precision specifications such as minimum trace/spacing down to 3 mil. They serve various industries including consumer electronics, healthcare devices, automotive, industrial automation, and AI electronics, providing services from prototypes to mass production.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110