Epec Engineered Technologies specializes in the design and manufacturing of custom printed circuit boards (PCBs), including advanced flex and rigid-flex circuit boards. They utilize technologies such as HDI (High-Density Interconnect) which employs blind and buried vias, and microvias to achieve higher circuitry density. Their manufacturing capabilities include precision engineering, rapid prototyping, and a focus on high-reliability applications across various industries including aerospace, medical, industrial, and defense. They offer a range of services from concept through production, including material specifications, product renderings, and turnkey solutions that encompass copper flex circuits, plastic enclosures, and cable assemblies.
FCBGA Series, FO Series, eWLB, FOPoS-chip first face down, FOPoS-chip first face up, FOPoS-chip last
Industrial SSDs, PCIe Gen4 NVMe SSDs, M.2 SSDs, U.2 SSDs, E1.S SSDs
HyCS® (High-Performance Spring), resin-insulated metal substrates for EV drives
MONSTER PAC typeC, MONSTER PAC typeF
automotive speakers, AVAS, amplifiers, AGS, ANC, sound effects, automotive controllers, interior and exterior products
AK-DR-101, AK-DR-102, AK-DR-103, AK-DR-104, AK-DR-105, AK-DR-106, AK-DR-107, AK-DR-111, AK-P-62, AK-DR-110